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Publicationer information ikon
Development of New Solder Fillers for Uniaxially
Conductive
Adhesive
s
Referentgranskad
Kivilahti, J.; Savolainen, P.; Nykänen, T.
Swedish Institute of Production Engineering Research
1993
Publicationer information ikon
A Solder Alloy Filled Z-Axis
Conductive
Adhesive
Referentgranskad
Savolainen, P.; Kivilahti, J.
Journal of Adhesion
1995
Publicationer information ikon
A Comparative Study of Uniaxially
Conductive
Solder Particle Filled
Adhesive
Referentgranskad
Kivilahti, J.; Savolainen, P.; Nykänen, T.
International Society for Hybrid Microelectronics (ISHM)
1993
Publicationer information ikon
Characterization of an Anisotripic Electrically
Conductive
Epoxy
Adhesive
Filled with Solder Alloy
Savolainen, P.; Kivilahti, J.
-
1993
Publicationer information ikon
Bismuth-filled Anisotropically
Conductive
Adhesive
for Flip Chip Bonding
Referentgranskad
Vuorela, M.; Kivilahti, J.; Holloway, M.; Fuchs, S.; Stam, F.
Helsinki University of Technology
2000
Publicationer information ikon
A Novel Solder Filled Uniaxially
Conductive
Adhesive
for Solder Replacement
Referentgranskad
Savolainen, Petri J.; Kivilahti, Jorma K.
Deutscher Verlag für Schweisstechnik
1994
Publicationer information ikon
Electrically
Conductive
Polyaniline
Adhesive
Referentgranskad
Pietilä, Mikko; Mäkelä, T.; Levon, K.; Kivilahti, J.; Isotalo, H.
International Conference on
Adhesive
Joining and Coating Technology in Electronics Manufacturing
2000
Publicationer information ikon
Electrically
conductive
polyaniline
adhesive
Referentgranskad
DOI
10.1109/ADHES.2000.860584
Pietilä, Mikko; Mäkelä, Tapio; Levon, K.; Kivilahti, Jorma; Isotalo, Heikki
IEEE Institute of Electrical and Electronic Engineers
2000
Publicationer information ikon
Evaluation of Bismuth as a Filler Material for Anisotropically
Conductive
Adhesive
Referentgranskad
Vuorela, M.; Kivilahti, J.K.
IEEE
2001
Publicationer information ikon
Conductive
Adhesive
s
Eskelinen, M.; Kivilahti, J.
-
1995
Development of New Solder Fillers for Uniaxially
Conductive
Adhesive
s
Referentgranskad
1993
A Solder Alloy Filled Z-Axis
Conductive
Adhesive
Referentgranskad
1995
A Comparative Study of Uniaxially
Conductive
Solder Particle Filled
Adhesive
Referentgranskad
1993
Characterization of an Anisotripic Electrically
Conductive
Epoxy
Adhesive
Filled with Solder Alloy
1993
Bismuth-filled Anisotropically
Conductive
Adhesive
for Flip Chip Bonding
Referentgranskad
2000
A Novel Solder Filled Uniaxially
Conductive
Adhesive
for Solder Replacement
Referentgranskad
1994
Electrically
Conductive
Polyaniline
Adhesive
Referentgranskad
2000
Electrically
conductive
polyaniline
adhesive
Referentgranskad
DOI
10.1109/ADHES.2000.860584
2000
Evaluation of Bismuth as a Filler Material for Anisotropically
Conductive
Adhesive
Referentgranskad
2001
Conductive
Adhesive
s
1995
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